bga

基本解釋

Fitting option BGA nozzle ensures excellent result and efficient.
選購專用BGA風(fēng)咀,使拆焊效果更佳及操作更快捷。
Desirable for high-performance Ball Grid Array (BGA) package.
高性能球形焊點(diǎn)陣列封裝需要倒裝焊。
This method meets the needs of the on-line test of BGA coplanarity.
該測量方法可以滿足BGA(球腳陣列)封裝引腳尺寸的實(shí)時(shí)在線檢測的需要。
BGA measurement is measured for inside solder point.
BGA量測以最內(nèi)側(cè)焊點(diǎn)為量測依據(jù)。
This procdure provides instruction for lead free BGA reballing process.
該程序?yàn)闊o鉛。