die pad
基本解釋
- 下墊板,沖模墊;芯片安裝面積
英漢例句
- From the results of numerical simulation, it should decrease the friction of die and sheet in practice as possible. The optimal pressure-pad-force is obtained through FEM analysis.
從數(shù)值模擬結(jié)果分析中得知,在實際拉深過程中要盡量減小模具和板料的摩擦,通過有限元模擬分析方法得到最佳壓邊力數(shù)值。 - Accroding to the structure characteristics of the Santana brake pad, determined product stamping process and blank size, the die design method was introduced, and solved the bending spring back.
根據(jù)桑塔納汽車剎車片卡子結(jié)構(gòu)特點,確定該產(chǎn)品的沖壓工藝和產(chǎn)品展開尺寸,介紹模具設(shè)計方案,解決產(chǎn)品彎曲回彈問題。
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雙語例句
詞組短語
- die e pad 下墊板
- PITCH HOLE DIE PAD 球洞的墊;距孔墊
- depressed die pad 下凹晶片焊墊
- polyurethane pad blanking die 聚氨酯沖裁模
短語
專業(yè)釋義
- 芯片安裝面積
- 下墊板