electronic packaging

常見(jiàn)例句

Electronic packaging design;
電子封裝設(shè)計(jì)；
With the change of material and technics in electronic packaging, it brings the problem of solder joint reliability.
電子封裝高度集成化，使得焊點(diǎn)可靠性評(píng)估更加困難，而封裝無(wú)鉛化，又給焊點(diǎn)可靠性研究帶來(lái)新的問(wèn)題。
ANSYS Q3D Extractor software is the premier 3-D and 2-D parasitic extraction tool for engineers designing electronic packaging and power electronic equipment.
ANSYS Q3D提取軟件是首屈一指的3-D和2-D寄生提取工具，電子封裝和電力電子設(shè)備設(shè)計(jì)的工程師。

They are working toward goal of 100% electronic distribution of software with no packaging or shipping of products.
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