encapsulant

基本解釋

This curable materials could be used in organic encapsulant.
此材料可以做為有機(jī)封裝材。
Buried Service Wire Splice A watertight splice filled with an encapsulant.
地下服務(wù)導(dǎo)線接頭一種填充了密封劑的不漏水的接頭。
DU901 is a one component, epoxy encapsulant designed for use as a repairable underfill resin for CSP or BGA.
簡介：道爾DU901是一種單組分環(huán)氧密封劑，用于CSP或BGA底部填充制程。
The thermal and mechanical properties of the modified epoxy encapsulant were introduced.
并對改性后封裝料的結(jié)構(gòu)、熱性能和機(jī)械性能作了詳細(xì)介紹。
Kester proudly announces that it has been awarded a patent for its Reflow Encapsulant technology including material and method of use.
凱斯特驕傲地宣布,它已獲得回流密封劑技術(shù)(其中包括材料和使用方法)的專利。