external thermal resistance

基本解釋

Curves of internal thermal resistance of different typical structures vs. heating chip areas and external resistance vs. package surface areas are plotted.
繪制了多種典型結構的內(nèi)熱阻與發(fā)熱芯片面積的關系曲線和外熱阻與封裝表面積的關系曲線；
In wind resistance than normal, self-respect, and knock against bare and associated external load conditions, thermal insulation layer is not with the bottom separation, fall off.
在抗風比、自重以及正?？呐龅葍?nèi)、外力相聯(lián)系的負載條件下，保溫層不致與慕底別離、掉落。