solder bump

基本解釋

During subsequent reflow the solder pulls back onto the wettable pad surface to form a solid solder bump structure.
在下一個回流工序，錫膏浸潤焊盤表面，形成一個固態(tài)錫膏凸起。
With the trend toward miniaturization, solder bumps are getting smaller, and the electric current loading of each solder bump is getting higher.
隨著電子產(chǎn)品之微小化，焊料凸塊的尺寸越來越小，而焊料凸塊的電流密度也隨之增大。
Research status of laser reflow on solder bump forming of area array packages are introduced, and experimental analysis on laser reflow of PBGA solder ball is performed.
介紹了激光重熔在面陣列封裝釬料凸點成形中的研究進展，并且對PBGA共晶釬料球激光重熔進行了工藝研究。