solder joint

基本解釋

• 軟焊接合；釬焊接頭

英漢例句

雙語例句

• Through non-linear finite analysis , the dependence of fatigue life of solder joint on thermomechanical properties of underfill was calculated.
  通過非線性有限元分析，計(jì)算出焊點(diǎn)疲勞壽命對(duì)下部填充料基本熱力學(xué)性質(zhì)的依賴關(guān)系。
• Research progress of lead-free solder, invalidation models of solder joint, solder joint reliability evaluation and the defects of solder joints in recent years have been reviewed.
  筆者就近年來國(guó)內(nèi)外開發(fā)的無鉛焊料、焊點(diǎn)的失效模式、焊點(diǎn)可靠性評(píng)價(jià)方法和焊點(diǎn)的主要缺陷進(jìn)行了綜述；
• The solder will be dull looking and if the gold content in the solder exceeds about5% the solder joint will be brittle.
  焊點(diǎn)外觀將變得暗淡，此外，如果焊料中的金成分超過約5%時(shí)，焊點(diǎn)將會(huì)變脆。

• solder joint更多例句

詞組短語

短語

• porous solder joint 多孔焊點(diǎn)
• Starved Solder Joint 少錫焊點(diǎn)
• Solder joint strength 關(guān)于焊點(diǎn)的強(qiáng)度;焊點(diǎn)強(qiáng)度
• solder joint connection 焊點(diǎn)連接
• Function of Solder joint 焊點(diǎn)的功能

• solder joint更多詞組

專業(yè)釋義

電子、通信與自動(dòng)控制技術(shù)

• 焊錫接點(diǎn)

  Finally, the cohesive zone model (CZM) was applied to simulate the damage process of solder joint under drop impact loading.
  本文的研究成果為跌落沖擊過程中焊錫接點(diǎn)數(shù)值模擬提供了必要的基礎(chǔ)。

• 焊接接縫

能源科學(xué)技術(shù)

• 焊點(diǎn)

  The thickness of oxide-film on the surface of solder joint is a main inner factor for corrosion.
  焊點(diǎn)表面氧化膜厚度是影響腐蝕的一個(gè)最主要的內(nèi)部因素。

  物理學(xué)

• 焊點(diǎn)

  When the main cracks develop or join each other and the equivalent damage in solder joint grows up quickly, the electronic-resistance increases abruptly and "electronic-resistance strains - time" graph hoiks.
  當(dāng)主裂紋通過擴(kuò)展或互相連接導(dǎo)致焊點(diǎn)損傷變得很大時(shí)，電阻具有突變的性質(zhì)，“電阻應(yīng)變-時(shí)間”曲線急劇上升。

• 互連凸點(diǎn)
• 焊接