temperature cycling

基本解釋

Temperature cycling of components.
零件溫度循環(huán)。
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Result show that IMC layer increased with the cycles, and it grew faster under low temperature cycling.
結(jié)果表明，隨著循環(huán)周期的增加，界面IMC層的厚度增加，且低溫極限溫度越低時(shí)IMC生長(zhǎng)越快。
It is found that the stress relaxation is obvious and the trend of stress accumulated enhancement exists with the temperature cycling loaded.
對(duì)焊點(diǎn)最大應(yīng)力節(jié)點(diǎn)進(jìn)行時(shí)間歷程處理，發(fā)現(xiàn)應(yīng)力松弛現(xiàn)象嚴(yán)重，且應(yīng)力值隨著溫度循環(huán)加載具有累積迭加的趨勢(shì)。

Nanophosphate EXT is designed to extend these capabilities over a wider temperature range, enabling customers to deploy more advanced solutions that increase performance in applications that frequently experience battery cycling at extreme temperatures.
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