ENIG

常見例句

Electroless nickel under immersion gold (ENIG) provides a solderable coating, but is expensive.
浸金下無電鍍鎳(ENIG)涂層可以提高可焊性,但此方法比較昂貴。
Electrolytic gold, ENIG, immersion tin, immersion silver, OSP &Lead Free HASL are already in production.
已投產(chǎn)無鉛工藝有電金、沉金、沉錫、沉銀、有機保護膜及無鉛噴錫。
Electrolytic gold, ENIG, immersion tin, immersion silver, OSP &Lead Free HASL are already in production by 2006.
2006年已投產(chǎn)無鉛工藝有電金;沉金;沉錫;沉銀;有機保護膜及無鉛噴錫.
The sequence of NIRUNA ENIG corresponds with common processes and can be adapted to electroless Nickel Gold plants after adjustment.
Niruna沉鎳金流程程序相應(yīng)于一般沉鎳金流程;經(jīng)調(diào)整后可被改用于此流程.
Volume manufacturing company can HASL, ENIG Shen, antioxidant (OSP), Shen tin, etc. in line with the ROHS directive single double-sided circuit boards.
公司可批量制造噴錫、沉鎳金、抗氧化（OSP）、沉錫等各類符合ROHS指令的單雙面電路板。
The high activity of TSF-6850 improves wetting of Lead Free alloys difficult to solder to substrate finishes including OSP-Cu, ENIG and Immersion finishes.
具有高活性的TSF-6850能夠提高難于焊接到襯底終飾上的無鉛合金(其中包括OSP-Cu、ENIG和浸漬終飾)的濕化特性。