wafer

音標(biāo)發(fā)音

Cut the fennel into wafer-thin slices.
把茴香切成薄薄的小片。
She opened her mouth to receive the papery - thin wafer.
她張開嘴領(lǐng)受薄薄的圣餅.
Single - wafer processes use higher pressures than the batch processes.
單片工藝比多片工藝要用較高的壓力.
Wafer is playing better than TMac right now. He is athletic and shoots very well.
現(xiàn)在的沃弗爾打得比麥蒂好. 他是一個(gè)天生運(yùn)動(dòng)員,投籃命中不錯(cuò).
To smooth the surface of a wafer or semiconductor crystal.
使晶片或半導(dǎo)體晶體的表面光滑的過程.

硅片
A 6 D wafer positioning system used in 0.8~1μm wafer stepper is introduced in the paper.
介紹用于0．8～1μm分步重復(fù)投影光刻機(jī)的六自由度硅片定位系統(tǒng)。
晶圓
The main content of the research is to design a small-scaled wafer pre-aligner for 12-inch wafer.
主要研究內(nèi)容是研制用于12英寸晶圓的小型化預(yù)對(duì)準(zhǔn)系統(tǒng)。
薄片
We firstly proposed and demonstrated the mode-locking of a Nd:YAG ceramic laser by the optical nonlinear interference modulation in GaAs wafer.
首先,我們提出了利用GaAs薄片的非線性F-P干涉效應(yīng)來鎖模的方法,并在Nd:YAG陶瓷激光器中成功實(shí)現(xiàn)了鎖模。
晶片

晶片
Two main wafer slicing methods are used currently.
目前,晶片切割主要的方法有金剛石內(nèi)圓切割和線切割。
晶圓
With the increasing of wafer diameter and the reducing of chip thickness, high machining efficiency and quality are required.
隨著半導(dǎo)體晶圓直徑的增大和芯片厚度的減薄，對(duì)晶圓表面加工質(zhì)量和加工效率提出了更高的要求。
計(jì)算機(jī)科學(xué)技術(shù)
芯片搬運(yùn)
晶片
晶元
圓片
大晶片
薄片
干膠片