wire bonding

基本解釋

Wire bonding is a critical technique for realizing microwave hybrid circuit.
引線鍵合是實現(xiàn)微波混合電路的關(guān)鍵技術(shù)。
Gas plasma technology can be used to clean pads prior to wire bonding to improve bond strengths and yields.
氣體等離子技術(shù)能夠用于在引線鍵合前清洗焊盤以改進鍵合強度和成品率。
The result shows that the plastic strain at the heel region induced by wire bonding process, molding process and the thermal stress and strain in solder reflow are the main causes of heel crack.
結(jié)果顯示由于引線鍵合工藝、注塑工藝以及回流焊中封裝體各部分不同的熱膨脹系數(shù)引起的熱應(yīng)力和塑性變形是產(chǎn)生引腳跟斷裂的主要因素。

Today, the Commerce Department is informing the member nations of the Coordinating Committee on Multilateral Export Controls (COCOM) that the United States will decontrol the sale of wire-bonding technology to "proscribed destinations, " i.e. the Warsaw Pact.
CENTERFORSECURITYPOLICY: Center For Security Policy
Contending that wire-bonding machines were available to the Soviet Union from non COCOM-controlled foreign sources, Commerce Secretary Robert Mosbacher decided -- despite vigorous objections from the Defense Department and a contrary finding from the U.S. intelligence community -- to utilize his authority under the Export Administration Act to decontrol this technology.
CENTERFORSECURITYPOLICY: Center For Security Policy

引線鍵合
The experiment results show that the motion characteristics of the bond head can satisfy the requirements of IC wire bonding.
實驗結(jié)果表明鍵合頭的運動特性能夠很好地滿足芯片引線鍵合的要求。
金線鍵合
Regarding the requirement to stack more chips, low and long wire looping is needed in the wire bonding process.
為了適應(yīng)該封裝結(jié)構(gòu)的需要,在金線鍵合這一工藝中,鍵合線弧要求更低、更長。
芯片焊線
線結(jié)合

引線鍵合
Wire bonding is the most important process in semiconductor packaging industry, that's because kinds of failure are related to this process.
引線鍵合工藝是半導(dǎo)體封裝中的重點控制工序,這是由于很多失效原因與它相關(guān)。
線結(jié)合