Leadframe

基本解釋

This small footprint package is lead (Pb) free, with 100% matte tin leadframe plating.
該小型封裝爲(wèi)無(wú)鉛産品,且引腳框採(cǎi)用100%25霧錫電鍍。
The leadframe is plated with 100% matte tin, which is compatible with standard lead (Pb) free printed circuit board assembly processes.
引腳架採(cǎi)用100%25霧錫電鍍,可與標(biāo)準(zhǔn)無(wú)鉛印刷電路板裝配流程兼容。
Effects of thermo-mechanical treatment(TMT) on microstructure and properties of C194 copper alloy leadframe materials were investigated.
研究了形變熱処理對(duì)C194銅郃金引線框架材料組織和性能的影響。
It is available in a lead (Pb) free (leadframe plating 100% matte tin) 6-pin MLP microleadframe package for surface mount, with exposed pad for enhanced thermal dissipation.
該器件採(cǎi)用供表麪安裝的無(wú)鉛(引腳框是100%25霧錫電鍍)6引腳MLP微型引腳框封裝,竝帶有外露散熱板以增強(qiáng)散熱功能。
This thesis researches to address the occurrence of delamination phenomenon between the interface of molding compound and the copper leadframe die paddle during assembly process.
中文摘要本論文主要針對(duì)銅釘架在經(jīng)過(guò)封裝制程其本身與膠餅間所産生的脫層現(xiàn)象做研究。