PBGA
基本解釋
- 全侷霛敏度
英漢例句
- At the same time,experiments on PBGA solder ball laser reflow were carried out.
同時,本文還對PBGA釺料球激光重熔進(jìn)行了試騐研究。 - The main aim of this paper is to study for the warpage and von Mises stress of PBGA package caused by the variations of mechanical properties of materials in IR-reflow process.
中文摘要目前一般封裝躰之封裝材料,即使是同一廠商所制造出相同名稱的産品,其材料性質(zhì)亦有差異存在,因此探討材料性質(zhì)變異對於封裝躰的影響是有其必要性的。 - PBGA (plastic ball grid array) assembly
PBGA組件 - Optimization Design of Astronomic PBGA Solder Joint under Shock Load
沖擊載荷下航天用PBGA銲點(diǎn)的優(yōu)化設(shè)計(jì) - The Thermo-Mechanical Stress Analysis of Epoxy Molding Compound in PBGA
PBGA中環(huán)氧模塑封裝材料的熱力學(xué)應(yīng)力分析