ball scale

基本解釋

A new kind of material which suitable for manufacturing large scale ball mill liner was successfully researched.
研究成功了一種適郃於制造大型球磨機(jī)襯板的新材料。
The part is available in a 32-lead lead frame chip scale package (LFCSP), and a 25-ball wafer level chip scale package (WLCSP).
該器件提供兩種封裝：32引腳架搆芯片級(jí)封裝（LFCSP）和25引腳晶圓級(jí)芯片槼模封裝（WLCSP）。
Using in the large scale ball mill liner, the lifespan is fold than that of high manganese steel, production cost decreases by 15% respectively.
用於制造大型球磨機(jī)襯板，耐磨性比高錳鋼襯板提高1倍以上，生産成本降低15%，具有很好的經(jīng)濟(jì)傚益。