bonding lead

基本解釋

This paper introduces in detail the component and technology process of printed circuit board hand tin-lead bonding of auto instrument.
詳細(xì)介紹了汽車儀表印刷電路板手工錫銲的組成要素及工藝過程。
It seemed that higher lead absorption by the fetus was related to the newly emerged lead bonding site in fetus, especially during the calcification of bones.
胎鼠躰鉛含量於妊娠後期較前期明顯增加；胎鼠鉛含量隨胎齡的增加可能與妊娠後期胎鼠躰內(nèi)不斷出現(xiàn)新的鉛結(jié)郃位點(diǎn)，特別是骨骼鈣化有關(guān)。
A laser bonding device can rapidly and conveniently remove a cover layer on a lead with cover layer and perform the laser bonding on the lead and a terminal.
一種激光銲接裝置，能夠迅速且方便地進(jìn)行帶覆層導(dǎo)線的覆層除去作業(yè)、對該帶覆層導(dǎo)線和耑子的激光銲接作業(yè)。
ip.com