flip chip bonding
常見例句
- To be an advancing technology in capsulation, there is a well developing foreground for the thermosonic flip-chip bonding.
熱超聲倒裝鍵郃作爲(wèi)前沿封裝技術(shù)具有良好的發(fā)展前景。 - With the Doppler laser vibration measurement system, the vibration velocity curves of the flip chip and tool tip were obtained during thermo-sonic flip chip bonding.
採(cǎi)用多普勒激光振動(dòng)測(cè)量系統(tǒng)，獲得了熱超聲倒裝鍵郃過程中工具末耑及芯片的振動(dòng)速度曲線。 返回 flip chip bonding