solder paste

基本解釋

Reflow Soldering: Melting, joining and solidification of two coated metal layers by application of heat to the surface and predeposited solder paste.
廻流銲：應用加熱金屬塗敷層的表麪和預塗銲膏，熔融，連接和凝固兩個金屬塗層。
The result of simulation indicated that higher printing velocity and printing pressure would improve the performance of solder paste printing if other factors were not considered.
研究表明：在不考慮其他銲膏印刷性能影響因素下，較高的印刷速度和印刷壓力能提高銲膏印刷性能。
Equipment specifically designed for use with solder paste.
於專爲錫膏設計的設備中使用。

銲膏
A kind of solder paste material was successfully developed.
研制出了新的無鉛銲膏材料。
膏狀釺料
Based on these tests, it proved that copper solder paste had a good wettability, and mechanical properties of brazed joints could reach the request.
証明了紫銅膏狀釺料具有良好的潤溼性,其釺銲接頭機械性能均達要求。
電子、通信與自動控制技術(shù)
銲膏
Mini-stencil is the traditional method used in the electronics manufacturing industry for the deposition of solder paste onto reworked component sites.
最小型模板用於把銲膏澱積到返脩的元件部位的電子制造業(yè)的傳統(tǒng)方法。
機械工程
銲鍚膏
銲膏