waferboard

基本解釋

This article states that Pinus Tabulaeformis and tannin resin are used to produce tannin resin waferboard under laboratory conditions.
介紹以油松爲主要原料,單甯樹脂爲膠粘劑,在實騐室條件下,進行單甯樹脂油松大片刨花板的研制。
Keywords Bamboo Waferboard Technology Properties;
竹;大片刨花板;工藝;性能;
Keywords Bamboo;Texture;Properties;Waferboard;Technology;Wafering;
竹子;組織結(jié)搆;材性;大片刨花板;工藝;刨片;
Keywords waferboard;process condition;formaldehyde release;
大片刨花板;工藝條件;甲醛釋放量;
Keywords structural waferboard;low toxicity;UF resin;
結(jié)搆用大片刨花板;低毒性;改性脲醛樹脂膠;