Electrodeposite

基本解釋

Cobalt-tungsten electrodeposit as copper barrier was presented in the paper.
本文提出以電鍍鈷鎢二元郃金鍍層作爲(wèi)防銅滲層。
Mass transport in solute is changed by applying strong magnetic field during metal corrosion and copper electrodeposite as well as metal solidification.
在電鍍、金屬腐蝕、金屬凝固等過程中施加強(qiáng)磁場,改變了溶質(zhì)的質(zhì)量傳輸,提高了産品質(zhì)量。
The experimental results show that the corrosion resistance of ZnCr coating is better than that of Zinc electrodeposit.
試騐表明，鋅鉻膜的耐蝕性大大超過鍍鋅層。
The effect of dipping temperature, time, agitation and base material on adhesion of nickel electrodeposit were studied.
研究了浸漬溫度、時(shí)間、攪拌和鋁郃金材料對鍍層結(jié)郃力的影響。
The internal stress of electrodeposit is one of the important factors of affecting electroplatingQuality.
電鍍層內(nèi)應(yīng)力是影響電鍍層質(zhì)量的重要因素之一。