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The study introduced the subminiature and pint-size encapsulation CPLD, which was welded to the tailor-made seat of DIP encapsulation. , and formed the integrated circuit that pending programmed. 該研究採用超小型或小型封裝的可編程器件CPLD，銲接到特制的DIP封裝的托座上，形成待編程的集成電路。