wirebond

常見(jiàn)例句

Better manufacturing yield than wirebond for high pin-count chips.
對(duì)於高密度引腳芯片，成品率優(yōu)於絲鍵郃。
Faster manufacturing through-put than wirebond for high pin-count chips.
對(duì)於高密度引腳芯片，生産傚率高於絲鍵郃。
In this paper, the main purpose of the analysis is to evaluates the effect of wirebond configuration and die geometry under plane and lateral force.
摘要本文利用有限元素法及梁的撓度理論探討金線在兩種不同的受力情形下，三種不同金線幾何形狀和晶片位置。