flip-chip

基本解釋

Flip Chip technology is a typical application.
倒裝芯片技術就是其中一個典型應用。
As an electric current passes through, the Joule heating and electromigration effects occur in the flip chip solder bumps.
當電流通過焊點時，會伴隨產生焦耳熱效應和電遷移效應。
A summary of developmental work done in the field of single pass high reliability Flip Chip Reflow Encapsulants.
關于單遍高可靠性倒裝片回流密封劑領域研發(fā)工作成就的綜述。
The current crowding effect and temperature distributions in flip chip solders are discussed.
本研究亦討論在覆晶焊點中之電流聚集效應及其溫度分布。
Delamination at the underfill/chip interface in a flip chip on board (FCOB) assembly was investigated through MSC.
采用通用有限元軟件MSC.