flip-chip
基本解釋
- 倒裝法,倒裝芯片
英漢例句
- Flip Chip technology is a typical application.
倒裝芯片技術(shù)就是其中一個(gè)典型應(yīng)用。 - As an electric current passes through, the Joule heating and electromigration effects occur in the flip chip solder bumps.
當(dāng)電流通過焊點(diǎn)時(shí),會(huì)伴隨產(chǎn)生焦耳熱效應(yīng)和電遷移效應(yīng)。 - A summary of developmental work done in the field of single pass high reliability Flip Chip Reflow Encapsulants.
關(guān)于單遍高可靠性倒裝片回流密封劑領(lǐng)域研發(fā)工作成就的綜述。 - The current crowding effect and temperature distributions in flip chip solders are discussed.
本研究亦討論在覆晶焊點(diǎn)中之電流聚集效應(yīng)及其溫度分布。 - Delamination at the underfill/chip interface in a flip chip on board (FCOB) assembly was investigated through MSC.
采用通用有限元軟件MSC.
詞組短語
- flip -chip bonder [電子]倒裝焊接器
- Flip -chip Substrates 倒裝芯片基片
- FLIP -CHIP MOUNTER 全自動(dòng)高速倒裝機(jī)
短語
專業(yè)釋義
- 后滾翻
- 芯片反轉(zhuǎn)