flip-chip

常見(jiàn)例句

Flip Chip technology is a typical application.
倒裝芯片技術(shù)就是其中一個(gè)典型應(yīng)用。
As an electric current passes through, the Joule heating and electromigration effects occur in the flip chip solder bumps.
當(dāng)電流通過(guò)焊點(diǎn)時(shí)，會(huì)伴隨產(chǎn)生焦耳熱效應(yīng)和電遷移效應(yīng)。
A summary of developmental work done in the field of single pass high reliability Flip Chip Reflow Encapsulants.
關(guān)于單遍高可靠性倒裝片回流密封劑領(lǐng)域研發(fā)工作成就的綜述。
The current crowding effect and temperature distributions in flip chip solders are discussed.
本研究亦討論在覆晶焊點(diǎn)中之電流聚集效應(yīng)及其溫度分布。
Delamination at the underfill/chip interface in a flip chip on board (FCOB) assembly was investigated through MSC.
采用通用有限元軟件MSC.
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
完成某集成電路封裝（叩焊芯片）內(nèi)部實(shí)際的電氣連接的焊料中的鉛。