backside chipping

基本解釋

• [電子、通信與自動(dòng)控制技術(shù)]背麪崩裂

英漢例句

雙語(yǔ)例句

• The dicing kerfs have been reduced to below 20 um in many cases, with no chipping on either front or backside.
  在很多情況下，刻劃寬度可以小到20um，上下都沒(méi)有碎屑。
  blog.sina.com.cn

• backside chipping更多例句

專業(yè)釋義

電子、通信與自動(dòng)控制技術(shù)

• 背麪崩裂

  And finally it introduces two effective methods to control backside chipping: Stress Relief Step Cutting and Dicing Before Grinding.
  同時(shí)介紹了兩種控制背麪崩裂較有傚的切割工藝:減少應(yīng)力的開(kāi)槽切割工藝和DBG工藝。