wafer dicing saw

常見例句

雙語例句

• The key technologies of Auto dicing saw, such as air spindle, transfer and orientation of wafer, automatic alignment and automatic wash are analyzed.
  從全自動劃片機的工作機理出發(fā)，分析空氣靜壓電主軸、晶圓傳輸定位、自動對準(zhǔn)、自動清洗等全自動劃片機的關(guān)鍵技術(shù)；
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