wafer dicing saw
常見(jiàn)例句
- The key technologies of Auto dicing saw, such as air spindle, transfer and orientation of wafer, automatic alignment and automatic wash are analyzed.
從全自動(dòng)劃片機(jī)的工作機(jī)理出發(fā)，分析空氣靜壓電主軸、晶圓傳輸定位、自動(dòng)對(duì)準(zhǔn)、自動(dòng)清洗等全自動(dòng)劃片機(jī)的關(guān)鍵技術(shù)； 返回 wafer dicing saw